Structurally encoded component and method of manufacturing structurally encoded component

ABSTRACT

A method of inserting a data structure into a component using a 3D printer is provided. The method includes providing the data structure having at least one structural parameter associated with the component, converting the data structure into indicia representative of the data structure, and manufacturing the component containing the indicia.

RELATED APPLICATION DATA

This application is a continuation of U.S. patent application Ser. No.15/243,036, filed Aug. 22, 2016, which is a continuation of U.S.application Ser. No. 14/823,234, filed Aug. 11, 2015 (now U.S. Pat. No.9,424,503), which claims the priority benefit of U.S. ProvisionalApplication No. 62/035,875, filed Aug. 11, 2014, all of which are herebyincorporated in their entirety by reference herein. This applicationincorporates by reference in their entirety herein the disclosures ofU.S. Provisional Application No. 61/938,475, filed Feb. 11, 2014, U.S.patent application Ser. Nos. 14/302,133, 14/302,171 (now U.S. Pat. No.9,101,321), and Ser. No. 14/302,197, all filed Jun. 11, 2014, U.S.patent application Ser. No. 14/456,665, filed Aug. 11, 2014, U.S. patentapplication Ser. No. 14/822,613, filed Aug. 10, 2015 (now U.S. Pat. No.9,414,891), and U.S. Provisional Application No. 62/204,233, filed Aug.12, 2015, U.S. patent application Ser. No. 15/235,914, filed Aug. 12,2016, U.S. Provisional Application No. 62/419,341 filed Nov. 8, 2016,U.S. Provisional Application No. 62/419,364, filed Nov. 8, 2016, U.S.Provisional Application No. 62/419,353, filed Nov. 8, 2016, U.S.Provisional Application No. 62/419,373, filed Nov. 8, 2016, all of whichare hereby incorporated by reference in their entirety.

FIELD OF THE DISCLOSURE

The present disclosure relates to structurally encoding objects and, inparticular, to structurally encoded components.

BACKGROUND OF THE DISCLOSURE

The security and identification of particular goods, parts, orcomponents may require an identification tag, plate, or label in theform of a series of numbers or letters, a barcode, or another type ofreadable code. Such identification means may become ineffective due towear, intentional or unintentional removal, or another type ofalteration. For effective tracking, identification, and updates,component data storage and communication means must be more robust thanwhat is currently available for sensitive objects, such as medicaldevices and implants, vehicles or vehicle parts, aircraft or aircraftparts, spacecraft or spacecraft parts, military equipment, firearms orother weapons, jewelry or similar valuables, commercial electronicdevices, toys and other commercial goods, or pharmaceutical goods, asdisclosed in U.S. Pat. No. 7,900,832, and in U.S. Pat. No. 9,424,503which are hereby incorporated herein by reference. Moreover, the size ofexisting identification devices limits the amount of information capableof being included in the data storage and communication means.

SUMMARY OF THE DISCLOSURE

In accordance with an embodiment of the present disclosure, a method ofinserting a data structure into a component using a 3D printer isprovided. The method includes providing the data structure having atleast one structural parameter associated with the component, convertingthe data structure into indicia representative of the data structure,and manufacturing the component containing the indicia.

In accordance with an embodiment of the present disclosure, a method ofembedding encoded data into a structurally encoded component isprovided. The method includes providing data comprising structuralparameters of at least one of size, shape, color, dimension, height,width, depth, material, blueprint, design, time, size of particles to bedeposited, and step-by-step instructions for producing the structurallyencoded component, populating a data structure with the structuralparameters, converting the data structure into indicia representative ofthe data structure, and controlling an operation of a 3D printermaterial extruding jet to selectively deposit material in a plurality ofsuccessive layers to build the structurally encoded component whileinserting indicia derived from and conforming to the structuralparameters into the structurally encoded component.

In accordance with an embodiment of the present disclosure, a system isprovided including a plurality of structural parameters, a datastructure populated with at least one of the structural parameters,indicia representing the data structure, a 3D printer configured toproduce a plurality of layers of material, and a component produced bythe plurality of layers in conformity with the structural parameters andcontaining the indicia representative of the data structure.

BRIEF DESCRIPTION OF THE FIGURES

While the specification concludes with claims particularly pointing outand distinctly claiming the present disclosure, it is believed that thepresent disclosure will be better understood from the followingdescription in conjunction with the accompanying Drawing Figures, inwhich like reference numerals identify like elements, and wherein:

FIG. 1 is a side perspective view of a structurally encoded component inaccordance with aspects of the present disclosure;

FIG. 2 is a side perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 3 is a side perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 4 is a front perspective view of a structurally encoded componentin accordance with further aspects of the present disclosure;

FIG. 5 is a front perspective view of a structurally encoded componentin accordance with further aspects of the present disclosure;

FIG. 6 is a front perspective view of a structurally encoded componentin accordance with further aspects of the present disclosure;

FIG. 7 is an enlarged cross sectional view of a structurally encodedcomponent in accordance with further aspects of the present disclosure;

FIG. 7A is an enlarged cross sectional view of a structurally encodedcomponent in accordance with further aspects of the present disclosure;

FIG. 8 is a diagram relating to indicia data of a structurally encodedcomponent in accordance with further aspects of the present disclosure;

FIG. 8A is a diagram relating to indicia data of a structurally encodedcomponent in accordance with further aspects of the present disclosure;

FIG. 9 is a side perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 10 is a perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 11 is a perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 12 is a perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure;

FIG. 13 is a perspective view of a structurally encoded component inaccordance with further aspects of the present disclosure; and

FIG. 14 illustrates a method of inserting a data structure into acomponent using a 3D printer.

DETAILED DESCRIPTION

In the following detailed description of the preferred embodiment,reference is made to the accompanying drawings that form a part hereof,and in which is shown by way of illustration, and not by way oflimitation, a specific preferred embodiment in which the disclosure maybe practiced. It is to be understood that other embodiments may beutilized and that changes may be made without departing from the spiritand scope of the present disclosure.

The present disclosure relates to U.S. provisional patent application61/938,475, U.S. patent application Ser. No. 14/302,133, U.S. patentapplication Ser. No. 14/302,171, and U.S. patent application Ser. No.14/302,197, all of which are hereby incorporated by reference in theirentirety.

Reference is now made to FIG. 1, which shows a structurally encodedcomponent rod structure 10 having a series of notches 12 in onelongitudinal side 14 of the rod structure 10. The structurally encodedcomponent rod structure 10 of the preferred embodiment of FIG. 1features a readable portion 16 shown in FIG. 1 to be integral with anouter structure portion 18 of a structurally encoded component 20. Thestructural encoding may also be integrated within a component so as torequire imaging methods to obtain the encoded data. One or moreembodiments of the structurally encoded component 20 described in thepresent disclosure includes a readable portion 16 and/or indicia 26disposed at a subsurface location of the structurally encoded component.In this way, one could prevent modification of the encoding so as toprevent counterfeiting of original equipment manufacturer (OEM) parts.Alternatively, the readable portion 16 of the structurally encodedcomponent 20 may be disposed upon the main portion 18 of thestructurally encoded component 20. As used herein, a structurallyencoded component refers to any component, device, part, assembly, orother physical structure capable of being encoded. The presentdisclosure further includes unique device identification and informationextraction through high data density structural encoding.

The readable portion, or any readable element, as discussed throughoutthe present disclosure, may be a radiopaque element or another structurewith properties capable of being detected using such methods as x-ray,fluoroscopy, computed tomography, ultrasound, positron emissiontomography, magnetic resonance imaging, other forms of imaging,including medical imaging and industrial imaging, known in the art, orany imaging device or system that utilizes one or more frequenciesand/or wavelengths along the electromagnetic spectrum. The readableportion 16 may be coupled to the main portion 18 by such means asfasteners or adhesives or through interference fit. Each of the notches12 is a modification to the surface of the readable portion 16, has apredetermined width 22, and is located at a predetermined axial position24 so as to create indicia 26 representing one-dimensional data. The rodstructure 10 in the preferred embodiment is a radiopaque structure, suchas a tantalum rod. As will be further described below, the rod structure10 may have a variable density such that the rod structure containsindicia in the form of a variable density internal structure or aparticular mesh structure created by additive manufacturing, therebyincreasing the density of data coding. After fabricating thestructurally encoded component, the rod structure 10 and indicia 26 aredetectable and readable via a variety of methods such as x-ray,fluoroscopy, computed tomography, electromagnetic radiation, ultrasound,positron emission tomography, and magnetic resonance imaging. Theindicia 26 is detected and received by conventional imaging devices.Imaging software, preferably high resolution imaging software, thenreads the data from the indicia 26 to decode and store and/or displaythe information from the structurally encoded component 20.

In a first embodiment of the present disclosure, the data represented bythe indicia 26 on the surface of the rod structure 10 references uniqueinformation located in an external database. One example of suchinformation includes data from the indicia 26 representing a uniquenumerical identifier corresponding to a wealth of information located inan external database.

In further embodiments of the present information, the size of theindicia may be decreased, and the density of the data thereby increased,such that additional information beyond mere reference data may berecorded onto the structurally encoded component. Such embodiments arefurther discussed below.

In the preferred embodiment of the present disclosure, error correctionis used to increase the resolution of the imaging technology, therebyallowing an increase in data density. Error correction is discussed inmore detail below.

Referring now to FIG. 9, rod structure 310 includes a plurality ofthreads 312 in a spiral or helical configuration around thecircumference of the rod structure 310. Although the threads 312 shownin FIG. 9 are continuous to form a screw structure, such as a machinescrew, the inner diameter 314 between adjacent threads 312 is varied toform indicia. As indicated in FIG. 9, the predetermined indicia allowcoded data to appear within the functional structure of the rodstructure 310 before and after structurally encoded component.Alternatively, the outer diameter 316 of threads 312 may be varied inaddition to, or instead of, the variation of the inner diameter 314 toretain coded indicia on the rod structure 310. Further, the axialspacing 318 between adjacent threads 312 may be varied in order to storedata. Even further, the particular shape of the spacing between adjacentthreads 312, such as a square, triangular, or circular shape, may alsoallow data storage in the rod structure 310. A variation of thisembodiment includes a micromanufactured structurally encoded componenthaving indicia in or on the head 320 of the rod structure 310, such ascoded indicia in the head of a machine screw.

Any of the embodiments, including each particular structure, disclosedin the present application may include structurally encoded componentshaving the forms of, or being incorporated into, screws, rods, or otherdevices.

Referring now to FIG. 2, a structurally encoded component rod structure40 of a preferred embodiment of the present disclosure features a seriesof notches 42 around the circumference of the rod structure 40. Thestructurally encoded component rod structure 40 of the preferredembodiment of FIG. 2 features a readable portion 44 shown in FIG. 2 tobe integral with an outer structure portion 46 of a structurally encodedcomponent 48. Alternatively, the readable portion 44 of the structurallyencoded component 48 may be disposed upon the main portion 46 of thestructurally encoded component 48. The readable portion 44 may becoupled to the main portion 46 by such means as fasteners or adhesivesor through interference fit. Each of the notches 42 is a modification toan exterior surface 50 of the readable portion 44, has a predeterminedwidth 52, and is located at a predetermined axial position 54 so as tocreate indicia 56 representing one-dimensional data. The rod structure40 in the preferred embodiment is a radiopaque structure, such as ametallic rod. After integrating the structurally encoded component intoor onto an assembly or separate structure, the rod structure 40 andindicia 56 are detectable and readable via a variety of imaging methodssuch as x-ray, fluoroscopy, computed tomography, electromagneticradiation, ultrasound, positron emission tomography, and magneticresonance imaging. The notches 42 of the preferred embodiment may becreated using known manufacturing methods, such as using a lathe,milling machine, wire electrical discharge machining (EDM) machine, orother machining techniques or through additive manufacturing processes,as further discussed below. As opposed to indicia located only on a sideof a rod structure as shown in FIG. 1, positioning of indicia 56 aroundthe circumference of the rod structure 40, as shown in FIG. 2, increasesvisibility of the indicia 56 and readability of the data by imagingmethods. The indicia 56 is detected and received by imaging devices,which transmits the data to imaging software with sufficient resolutionfor accurately resolving the indicia. The imaging software reads theindicia 56 to decode and store and/or display the information from thestructurally encoded component 48.

Although the indicia 26 and 56 shown in FIGS. 1 and 2 is oriented in adirection perpendicular to the axis of the rod structures 10 and 40, theindicia of the rod structures 10 and 40 may be oriented in a skewed orslanted orientation such that the indicia is not perpendicular to theaxis of the rod structures 10 and 40. As will be recognized by onehaving ordinary skill in the art, any embodiment of the exemplary rodstructures shown in FIGS. 1-3 and 9 may include notches, threads, orsimilar surface modification. Furthermore, each notch, thread, orsimilar structure may vary in depth, cross-section, or geometric shapeacross the series or array for further data storage.

In a preferred embodiment of the present disclosure, the datarepresented by the indicia 56 on the surface of the rod structurereferences unique information located in an external database. Oneexample of such information includes the data from the indicia 56representing a unique number corresponding to a wealth of informationlocated in an external database, such information includingmanufacturer, model, design file, batch, lot, date of manufacture,sales, supply chain, engineering, assembly, material(s), history,ownership, and/or manufacturing process data.

Error correction is used in a preferred embodiment of the presentdisclosure to increase the resolution of the imaging technology, therebyallowing an increase in data density for a given measurement technology.By encoding, for example, a number into the structurally encodedcomponent through micro-machined holes and/or notches, sufficientpermutations of the code can be recorded. In a preferred embodiment of astructurally encoded component according to the present disclosure, astructurally encoded component contains, for one example, 400 microndiscrete notches. The full code width and the bit count could, in thisexample, be dictated by machining precision and accuracy, number ofvariable machining widths (e.g., 100 microns, 200 microns, and 300microns), total bar length, and image resolution. To ensure robustnessin the encoding scheme, error correction in the form of a Hamming codeis implemented in the preferred embodiment but any error correctionmethod known in the coding theory art could be employed. In thepreferred embodiment shown in FIGS. 1 and 2, four variable width notchesevery 250 microns allow eight bits of data to be encoded reliably everymillimeter and read by a computed tomography scan with sufficientresolution to identify the notches. This is an example under thepreferred embodiment having values that are “power of 2 friendly” inorder to clarify one embodiment of the present disclosure. The specificvalues of any particular embodiment of the present disclosure dependupon the imaging and manufacturing resolution, which will improve overtime, as one having ordinary skill in the art may recognize.

Referring now to FIG. 3, a structurally encoded component rod structure70 of a preferred embodiment of the present disclosure features multiplematerials in discrete layers 72 to create one-dimensional data aroundthe circumference of the rod structure 70. The structurally encodedcomponent rod structure 70 of the preferred embodiment of FIG. 3features a readable portion 74 shown in FIG. 3 to be integral with anouter structure portion 76 of a structurally encoded component 78.Alternatively, the readable portion 74 of the structurally encodedcomponent 78 may be disposed upon the main portion 76 of thestructurally encoded component 78. The readable portion 74 may becoupled to the main portion 76 by such means as fasteners or adhesivesor through interference fit. Similar to the notched indicia shown inFIGS. 1 and 2, the variance of material across the layers 72 in theembodiment shown in FIG. 3 creates indicia 80 representing data that isreadable across the axial dimension of the rod structure 70. Alternativeembodiments may feature multiple material layers readable across adifferent dimension or a structure having a different shape constructedusing layers of multiple materials.

Referring again to the preferred embodiment of FIG. 3, each of thedistinct material layers 72 has a predetermined width 82 and is locatedat a predetermined axial position 84 so as to create the indicia 80representing one-dimensional data. At least one of the layers 72 in therod structure 70 of FIG. 3 may be a radiopaque structure. In thepreferred embodiment each of the layers 72 is composed of a particularmaterial having some degree of opacity. Like the rod structures of FIGS.1 and 2, after incorporation of the structurally encoded component into,onto, or with a separate assembly or component, the rod structure 70 andindicia 80 of the structurally encoded component 78 of FIG. 3 aredetectable and readable via a variety of imaging methods such as x-ray,fluoroscopy, computed tomography, electromagnetic radiation, ultrasound,positron emission tomography, and magnetic resonance imaging. Theindicia layers 72 of the preferred embodiment shown in FIG. 3 arestructured so as to be visible from any side of the rod structure 70 toincrease readability of the data by imaging methods. The indicia 80 aredetected and received by imaging devices, which transmits the data toimaging software, preferably high resolution imaging software. Theimaging software reads the indicia 80 to decode and store and/or displaythe information from the structurally encoded component 78.

The information or data encoded onto or into the structurally encodedcomponents of the embodiments disclosed in the present disclosure may bedetected, decoded, read, transferred, stored, displayed, or processedaccording to such methods and devices disclosed in U.S. Pat. No.8,233,967 or U.S. Patent Application Publication No. 2013/0053680, bothof which are hereby incorporated herein by reference.

The structurally encoded component 78 of FIG. 3 is manufactured usingadditive manufacturing (AM) techniques. Additive manufacturing (AM),also known as additive fabrication, additive processes, additivetechniques, additive layer manufacturing, layer manufacturing, andfreeform fabrication, comprises a process of joining materials in orderto make objects from 3D model data, usually layer upon layer. Due totheir precision and programmability, AM processes may be used for any ofthe embodiments shown in FIGS. 1-3 to allow a reduction in the size ofthe indicia and, therefore, increased density of data included onto thesurface of the structurally encoded component rod structure. In somecases, machining may be sufficient to provide the indicia necessary forthe structurally encoded component rod structure. With increased datadensity, additional information beyond mere reference data may berecorded onto the structurally encoded component 78. The data recordedonto the structurally encoded component itself may include manufacturer,model, design file data, batch, lot, date of manufacture, sales, supplychain, engineering, assembly, material(s), component or assemblyhistory, ownership, or manufacturing process data that would otherwiseneed to be stored in and accessed through an external database.Additionally, AM allows complex, mass customized, internal structuresotherwise unavailable with conventional manufacturing, includingthree-dimensional structures discussed in further detail below.Moreover, AM eliminates the need for tooling and can therefore allowfabrication of structurally encoded components with unique identifierswithin the structure with no additional masks, molds or userinteraction.

ASTM International formed Committee F42 on Additive ManufacturingTechnologies in 2009 with the mission of setting the standards fordesign, process, and materials with regards to AM. The committee defineda taxonomy of seven sub-technologies that together constitute the fullsuite of AM techniques. The seven sub-technologies are described in ASTMF2792-12a, the details of which are hereby incorporated by referenceherein.

AM differs from subtractive manufacturing methodologies (SM) whichproduce final objects by removing material such as, but not limited to,milling, drilling, grinding, and carving from a bulk solid to leave adesired shape. An object manufactured by the AM process may use SM toremove parts or pieces of the object. Removed parts or pieces may beparts or pieces needed only temporarily to support sides or otherportions of the object during manufacturer. After removal of a piece orportion and upon completion of the SM process, another AM process may beperformed on the object from which pieces or portions have been removed.A sequence of alternating AM and SM processes may occur a plurality oftimes during the entirety of the total manufacturing process.

Each AM process begins with producing a three dimensional (3D)representation of the object to be produced. The method of 3D scanningcomprises acquiring the shape and size of an object by recording x,y,zcoordinates on the object's surface, shape, dimensions, internalfeatures, external features, and through collection of points convertingthe data into mathematical representation of the object.

The data representation of the object is stored in a stereolithographfile (STL) format. STL is the defacto standard interface for additivemanufacturing systems. The STL format, in binary and ASCII forms, usestriangular facets to approximate the shape of an object. The formatlists the vertices, ordered by the right-hand rule, an object as a setof planar or curved surfaces, Bezier B-spline surfaces, NURBS surfaces,mesh of polygons, triangles, or a combination of any of theaforementioned. The object may be a solid, hollow, and may represent aclosed volume or may not represent a closed volume.

Stereolithography is a vat photopolymerization process used to produceparts from photopolymer materials in a liquid state using one or morelasers to selectively cure to a predetermined thickness and harden thematerial into shape layer upon layer.

Stereolithography is an additive manufacturing process used in 3-Dprinting technology to create models, prototypes, patterns, andproduction parts. Thue process uses photopolymerization, which focusesultraviolet (UV) light onto a vat of photopolymer resin. Light causeschains of molecules to link together. The UV light etches a drawn,pre-programmed design or shape on to the surface of the photopolymervat. The photosensitive resin solidifies and forms a single layer of thedesired 3D object. This process is repeated for each layer in anadditive layer by layer process as an elevator platform containing thepolymer descends a distance equal to the thickness of a single layer ofthe design into the photopolymer vat. Then, a resin-filled jet nozzlemoves across the layer, re-coating it with another layer of material.The subsequent layer is traced, joining the previous layer. When thelast layer is added, the 3D process is complete and the object createdmay be immersed in a chemical bath to remove any excess resin. Theobject then may be cured in a UV oven. Layers may generally range inthickness from 0.05 mm to 0.15 mm, but can comprise any thickness.

Objects may be generated from the bottom up by using a vat with asomewhat flexible, transparent bottom, and focusing the UV or deep-bluepolymerization laser upward through the bottom of the vat. Astereolithography machine starts a print by lowering the build platformto touch the bottom of the resin-filled vat, then moving upward theheight of one layer. The UV laser then writes the bottom-most layer ofthe desired part upward through the transparent vat bottom, and thephotopolymer hardens selectively where the laser strikes. Then the vatis moved, flexing and peeling the bottom of the vat away from thehardened photopolymer; the hardened material detaches from the bottom ofthe vat and stays attached to the rising build platform, and new liquidphotopolymer flows in from the edges of the partially built part. The UVlaser then writes the second-from-bottom layer and repeats the process.The build volume can be much bigger than the vat itself, and only enoughphotopolymer is needed to keep the bottom of the build vat continuouslyfull of photopolymer.

Stereolithography may require support structures to prevent deformationcaused by gravity and to hold cross sections in place or resist lateralpressure from the spraying nozzle. Supports may be provided prior to theprinting process or inserted or removed at any time during the printingprocess. Supports may be manufactured during the printing process andremoved from the finished product. Some support may be a combination ofprovided prior to and during the printing process and manufacturedduring the printing process.

Stereolithographic and 3D models have been used in medicine to create 3Danatomical medical models. Computer scans using 3D CT scan, MRI, orother medical imaging process generate data sets comprising a series ofcross sectional images. Such images record tissues as levels of grey.Specific regions or organs may be selected in a segmentation process togenerate stereolithography.

Stereolithography may be in ASCII and binary format representations andthe STL file may describe unstructured or triangulated surface surfacesusing three-dimensional Cartesian coordinate systems.

Numerous types of AM processes exist for fabrication of objects. Themost prevalent AM process is 3D printing, which comprises fabrication ofobjects through the deposition of a material using a print head, nozzle,or another printer technology. The 3D printing process uses the STL fileas a template or an instruction set which guides the print head nozzleacross the print surface, dictating where the material is deposited, howmuch of the material is deposited, and how high the material is stacked.

Material extrusion is an additive manufacturing process where materialis selectively dispensed through an extrusion nozzle. The most commonimplementation of this method involves the extrusion of thermoplasticmaterial through a heated orifice. The materials available for the mostcommon implementation tend to be functional plastics that aresufficiently robust to withstand harsh environments such as chemical,mechanical, or temperature exposure. One form of material extrusion isfused deposition modeling (FDM), a process used to make thermoplasticparts through heated extrusion and deposition of materials layer bylayer

Vat photo polymerization is a process where liquid photopolymer in a vatis selectively cured by light-activated polymerization. A vat of liquidphoto curable polymer is selectively cured with an energy source such asa laser beam or other optical energy. The part is typically attached toa platform that descends one cure depth after a layer is completed andthe process is repeated. This class of additive manufacturing benefitsfrom feature sizes dictated by either the laser beam width or opticalresolution in the X and Y axis and minimum cure depth in Z.

Powder bed fusion uses energy to selectively fuse regions of a powder.The process selectively melts or sinters a layer of powder using anenergy source such as a laser or electron beam, lowering the layer by afabrication layer thickness, and adding a new powder layer by deliverywith a rake or roller and material storage mechanism. The processcontinues with the next layer. Unmelted powder in the bed actsinherently as support material for subsequently built layers.

One type of powder bed fusion is laser sintering (LS), also calleddirect metal laser melting which uses one or more lasers to selectivelyfuse or melt the particles at the surface, layer by layer, in anenclosed chamber. “Sintering” typically involves full or partialmelting, as opposed to traditional powdered metal sintering using a moldand heat and/or pressure. Another type of powder bed fusion is directmetal laser sintering (DMLS), which is used to make metal parts directlyfrom metal powders without intermediate “green” or “brown” parts.

Material jetting uses ink-jetting or other nozzle-based technology toselectively deposit the build material with a cure prior to theapplication of subsequent layers. Selectively deposited droplets ofbuild material used include photopolymer and wax. An exemplary versionof this technology may be ink-jetting multiple photo-curable polymersand follow the inkjet head with a UV lamp for immediate and full volumecuring. With multiple materials, fabricated items can be multi-coloredor materials can be chosen with varying stiffness properties.Ink-jetting is also naturally well suited for parallelism and thus canbe easily scaled to larger and faster production.

Binder jetting selectively deposited a liquid bonding agent in order tojoin powder materials and selectively depositing a binder into a layerof powder feedstock. Additional powder material is then dispensed from amaterial storage location by a rake or roller mechanism to create thenext layer. Some binder jetting technologies may require a post-annealfurnace cycle depending on the materials being used (e.g., metals,ceramics). One exemplary system may inkjet color (much like a commercialinkjet color printer) in addition to the binder into a powder, and maytherefore provide structures with colors throughout the structure forconceptual models. Another binder jetting system may utilize a postanneal process to drive out the binder to produce metal or ceramicstructures.

Sheet lamination bonds together individual sheets of material in orderto form three-dimensional objects. In one exemplary embodiment, sheetsof metal are bonded together using ultrasonic energy. The process hasbeen shown to produce metallurgical bonds for aluminum, copper,stainless steel, and titanium. A subsequent subtractive process betweenlayers adds internal structures and other complex geometries impossiblewith conventional subtractive manufacturing processes that start from abillet of material.

Directed energy deposition focuses thermal energy to fuse meltingmaterials as the material is deposited to a substrate. Energy sourcesinclude, but are not limited to, laser, electron beam, plasma arc,electron beam. Directed energy deposition processes typically use powderor wire-fed metals and exemplary applications of the process may includerepair of high value components used in aircraft engines. These directedenergy AM processes, as well as the other AM processes described above,can be used to add material to existing parts, components, or devices toprovide structurally encoded information. In addition, as the adaptationof AM technologies is advancing to provide end-use products, parts,components, and devices, structural encoding as described herein can bedesigned within a computer-aided design (CAD) file of a particular partto be fabricated and simultaneously fabricated within or integral withthe finished part.

The structurally encoded component of the present disclosure may bemanufactured by conventional methods such as a machining operation usingany milling, lathe machining, or drilling operation to include standardmachining and fabrication methods known in the art of manufacturingstructurally encoded components.

The embodiments of FIGS. 1-3 show a structurally encoded component rodstructure having a length of one centimeter. Exemplary embodiments ofeach structurally encoded component shown in FIGS. 1-3 include eachnotch or material variation having a thickness of 0.1-0.3 millimeters,which results in storage of about 30-40 bits of information on thestructurally encoded component rod structure. After utilizing bits forHamming code error correction, about 25-35 actual data bits createapproximately 30 million to 30 billion indexing options into an externaldatabase or for limited information stored on the structurally encodedcomponent such as a structurally encoded component expiration date andlot number.

Referring now to FIG. 4, a structurally encoded component platestructure 100 of a preferred embodiment of the present disclosurefeatures a two-dimensional array of modifications 102 to a surface 104of the plate structure 100. The structurally encoded component platestructure 100 of the preferred embodiment of FIG. 4 features a readableportion 106 shown in FIG. 4 to be integral with an outer structureportion 108 of a structurally encoded component 110. Alternatively, thereadable portion 106 of the structurally encoded component 110 may bedisposed upon the main portion 108 of the structurally encoded component110. The readable portion 106 may be coupled to the main portion 108 bysuch means as fasteners or adhesives or through interference fit. Themodifications 102 to the surface 104 of the plate structure 100 shown inFIG. 4 are holes 112 that are micromanufactured through the surface 104of the plate structure 100. The plate structure 100 may be composed ofany material such as a metal, polymer, or ceramic compatible with theimaging modality selected. Further, any single or combination ofcomposite or nanoparticle material, including fine particles between 1and 100 nanometers in size, may be used for the present structure, suchas the readable portion.

The preferred embodiment shown in FIG. 4 features a plate structure 100that is one centimeter squared and one millimeter thick and has aseven-by-seven array of holes 112. The holes 112 are spaced about onemillimeter from each other to provide 49 bits. After subtracting bitsused for error correction, approximately four trillion reliable databaseentry fields with error correction are provided by the seven-by-sevenarray of holes 112. A Hamming code is implemented in the preferredembodiment of the structurally encoded component with an additionaleight bits to provide for the detection and correction of single biterrors.

Referring now to FIG. 5, a structurally encoded component platestructure 140 of a preferred embodiment of the present disclosurefeatures a two-dimensional array of embedded markers 142 located at aninternal plane 144 of the structurally encoded component plate structure140. The embedded markers 142 of the preferred embodiment are internalvolumes of a second material of different density. The structurallyencoded component plate structure 140 of FIG. 5 features a readableportion 146 shown in FIG. 5 to be disposed upon an outer structureportion 148 of a structurally encoded component 150. Although not shownin FIG. 5, the readable portion 146 may be coupled to the main portion148 by such means as fasteners or adhesives or through interference fit.Alternatively, the readable portion 146 of the structurally encodedcomponent 150 may be integral with the main portion 148 of thestructurally encoded component 150. The second material having adifferent density than the plate structure shown in FIG. 5 may be asubstance of any material phase including a solid, liquid, or a gas. Theembedded markers 142 as an array of internal volumes of FIG. 5 may alsobe voids in the material of the readable portion 146 of the structurallyencoded component plate structure 140. The structurally encodedcomponent plate structure 140 may be composed of any material such as ametal, ceramic, or polymer.

Similar to the plate structure of FIG. 4, the preferred embodiment shownin FIG. 5 features a plate structure 140 that is one centimeter squaredand one millimeter thick and has a seven-by-seven array of internalvolumes or voids forming embedded markers 142. The volumes are spacedabout one millimeter from each other to provide 49 bits. Aftersubtracting bits used for error correction, four trillion reliabledatabase entry fields with error correction are provided by theseven-by-seven array of volumes or voids. A Hamming code is implementedin the preferred embodiment of the structurally encoded component withan additional eight bits to provide for the detection and correction ofsingle bit errors.

Referring now to FIG. 6, a structurally encoded component structure 170of a preferred embodiment of the present disclosure features athree-dimensional array 186 of embedded markers 176 located on a seriesof internal planes 174 of the structurally encoded component structure170 that are separated across the z-axis of the structurally encodedcomponent structure 170. Each of the internal planes 174 shown in FIG. 6comprise a three-dimensional array of embedded markers 176. The embeddedmarkers 176 in the preferred embodiment are internal volumes of a secondmaterial of differing density than a first material forming theremainder of the structurally encoded component structure 170. Theembedded markers 176 may additionally be composed of a materialdiffering from both the first and second materials forming anidentifiable structurally encoded component having three or morematerials, similar to the structurally encoded component shown in FIG.3. This material modulation further increases the density of datarecorded in the structurally encoded component structure 170.

The structurally encoded component structure 170 of the preferredembodiment of FIG. 6 features a readable portion 178 shown in FIG. 6 tobe disposed on an outer structure portion 180 of a structurally encodedcomponent 182. Although not shown in FIG. 6, the readable portion 178may be coupled to the main portion 180 by such means as fasteners oradhesives or through interference fit. Alternatively, the readableportion 178 of the structurally encoded component 182 may be integralwith or within the main portion 180 of the structurally encodedcomponent 182. The second material having a different density than thestructurally encoded component structure 170 shown in FIG. 6 may be asubstance of any material phase including a solid, liquid, or a gas. Thearray of internal volumes of FIG. 6 forming embedded markers 176 mayalso be voids in the material of the readable portion 178 of thestructurally encoded component structure 170. The structurally encodedcomponent structure 170 may be composed of any material such as a metal,ceramic, or polymer.

As with the embodiment shown in FIG. 5, each plane 174 in thethree-dimensional array 186 of the preferred embodiment shown in FIG. 6features a unique seven-by-seven two-dimensional array 184 of embeddedmarkers 176. The structurally encoded component structure 170 of FIG. 6features the seven unique two-dimensional arrays 184 along the planes174 such that the seven-by-seven-by-seven three-dimensional array 186 isformed. Data is extracted from the three-dimensional array 186 shown inFIG. 6 through volume imaging used with an extraction algorithm andadvanced error correction coding in three dimensions. Due to the largeamount of data within the internal array 186 of the structurally encodedcomponent structure 170 shown in FIG. 6, external databases may not berequired to access detailed structurally encoded component manufacturer,sales, supply chain, engineering drawings and analyses, assembly,material(s), component or assembly history, ownership, or manufacturingprocess data, or other related records. Through image analysis, a party,such as an owner, service professional, government or industry official,would have immediate access to records encoded entirely within thestructurally encoded component 182.

Reference is now made to FIG. 7, which shows a structurally encodedcomponent structure 200 of a preferred embodiment of the presentdisclosure. The structurally encoded component structure 200 of thepreferred embodiment is a metal mesh structure fabricated using additivemanufacturing (also known in the art as 3D printing). The MaterialsScience & Engineering article titled “Characterization of Ti-6Al-4V OpenCellular Foams Fabricated by Additive Manufacturing Using Electron BeamMelting” by Murr, et al. discusses such additive manufacturing methodsto produce such exemplary structures as are displayed in the article,and is hereby incorporated herein by reference. Through an AMmanufacturing process, a unique internal structure is formed whilemaintaining the structural requirements of the structurally encodedcomponent 200. A readable portion 202 includes an internal structure 204inside the readable portion 202. The internal structure 204 includeslinking structures 206 that interconnect to form the internal structure204. Individual linking structures 206 in the preferred embodiment shownin FIG. 7 each have a predetermined size and orientation in reference toa unique registration structure that would be included in everystructurally encoded component and easily identifiable. As shown in FIG.8, the size and orientation of a particular linking structure 206 of thepreferred embodiment of the present disclosure is predetermined torepresent binary data. Such orientation of linking structure may bereferred to as a Miller Index in the art of crystallography. As with theembodiments of the present disclosure shown in FIGS. 1-6, the data isread to gather valuable information relating to the structurally encodedcomponent. The data contained in the readable portion 202 of thestructurally encoded component structure 200 can be accurately readthrough non-invasive or non-destructive means such as x-ray,fluoroscopy, computed tomography, electromagnetic radiation, ultrasound,positron emission tomography, and magnetic resonance imaging. FIGS. 7Aand 8A show, in detail, the readable portion 202, internal structure204, and linking structure 206 of the structurally encoded componentstructure 200 according to one embodiment of the present disclosure. If,for example, the component structure 200 is load bearing, the linkingstructures 206 is capable of maintaining the desired and/or necessarymechanical properties for static or dynamic performance of the componentstructure 200.

One or more of the embodiments of the present disclosure arestructurally encoded components, which refers to the 3D encoding ofdigital information in a structure as variations in geometric orphysical features—widths, densities, color, feature angles, etc. Barcodes are an example of a 2D encoding of digital information withmodulations of color (dark versus light) with varying widths of printedbars on a surface. A typical embodiment of the structurally encodedcomponents of the present disclosure may contain data that is notreadily apparent to a viewer of the device structure. Further, encodingof the typical embodiments of the present disclosure is handled byphysical means other than those accomplished through circuitry,electromagnetic or other, within the structurally encoded componentitself or through a type of internal storage means such as magneticstorage means or the like. Such structurally encoded components, asdisclosed herein and described in relation to the typical and/orpreferred embodiments of the present disclosure allow simplifiedproduction, maintenance, and/or operation costs for identification,storage, and/or retrieval of unique structurally encoded component datawhile retaining a substantial amount of information with reducedprobability for error.

Referring now to FIGS. 10-14, the structurally encoded component of thepresent disclosure is shown in several preferred embodiments. Referringspecifically to FIG. 10, a structurally encoded vehicle part 310 isshown. The vehicle part 310 of the preferred embodiment shown in FIG. 10is an oil filter, which is a replaceable part in a vehicle's engineassembly. At an internal location 312 of the vehicle part 310, areadable portion 314 is structurally encoded with data that may berelated to the filter manufacturer, the filter serial number, thevehicle type or model for which the filter is designed, the manufactureor installation date, or any recall or manufacture service information.The readable portion 314 may be structured or manufactured according toany of the embodiments discussed above or shown in FIGS. 1-9. Suchencoded information may be read via any of the imaging methods discussedabove, including x-ray, fluoroscopy, computed tomography,electromagnetic radiation, ultrasound, positron emission tomography, andmagnetic resonance imaging, and may include error correction asdiscussed above. Other parts contemplated by the present disclosure mayinclude one or more fasteners, such as the machine screw shown in FIG.9, utilized in a vehicle or other assembly and encoded with datarelating to the part or assembly. One example of the structurallyencoded vehicle part includes a structurally encoded section of avehicle engine block constructed using laser engineered net shaping(LENS), an additive manufacturing directed energy deposition technology,onto the existing engine block structure manufactured by another method,such as traditional casting, forging, and machining. The methodsdescribed above may be used to provide structural encoding on virtuallyany automotive part by (1) directly fabricating components withstructural encoding either externally accessible or fully embeddedwithin the component and not accessible without one or more of theimaging processes described herein, or (2) fabricating a fraction orportion of a major component or subsystem with structural encodinginformation on or in it, and then incorporating the portion on or in themajor component either as an attachment or embedded within a largercomponent through assembly or integration during fabrication of thelarger component.

Referring now to FIG. 11, a structurally encoded vehicle frame 320 isshown to include a structurally encoded component 322. It iscontemplated that the structurally encoded vehicle frame 320 of thepresent disclosure may include a passenger car or truck frame, amotorcycle frame, a watercraft hull, an aircraft or spacecraft frame, orany military or law enforcement vehicle, aircraft, spacecraft, orwatercraft. The structurally encoded component 322 of the vehicle frame320 of the preferred embodiment shown in FIG. 11 is a frame gusset thatis welded onto the remaining frame portions to create the unitary frame.The structurally encoded component 322 may include a separate readableportion 324 or the component 322 may itself be the readable portion 324.The readable portion 324 is structurally encoded with data that may berelated, as non-limiting examples, to the vehicle manufacturer, thevehicle identification number (VIN) or serial number, the vehicle type,model, engineering drawings or analyses, or production number, themanufacture, assembly, or sale date, any recall, service, repair, orownership information.

Further, any of the embodiments of the present disclosure may includedata relating to the unique image, properties, or manufacturingcharacteristics of the part or component itself, such as particularprogramming language directed to identification or replication of thestructure.

In the preferred embodiment shown in FIG. 11, the structurally encodedcomponent 322 provides a redundant means of identifying the vehicle. Inthe event that a vehicle identification number displayed at othervehicle locations, such as displayed on a dashboard plate, a frameplate, or stamped onto the frame or engine, is altered, replaced, orremoved, the vehicle identification number contained in the data of thereadable portion 324 of the structurally encoded component 322 providesa secure means of retaining data pertaining to the vehicle with thevehicle. The structurally encoded component 322 may also take the formof another vehicle component such as a dashboard part, a vehicle panel,a wheel component, or an engine component.

The readable portion 324 may be structured or manufactured according toany of the embodiments discussed above or shown in FIGS. 1-9. Suchencoded information may be read via any of the imaging methods discussedabove, including x-ray, fluoroscopy, computed tomography,electromagnetic radiation, ultrasound, positron emission tomography, andmagnetic resonance imaging, and may include error correction asdiscussed above.

Referring now to FIG. 12, a weapon 330 having a structurally encodedcomponent 332 is shown. The weapon 330 shown in FIG. 12 is a firearm,but any weapon, such as a knife or other bladed weapon or a projectilelaunching weapon, is contemplated by the present disclosure. Thestructurally encoded component 332 is or includes a readable portion334, which is a barrel portion of the weapon 330. However, the readableportion 334 may be located elsewhere, such as a stock or grip of afirearm. As firearms and other weapons are sensitive objects that aretracked by government and law enforcement agencies, an embedded orotherwise secure readable portion 334 prevents illicit purchasing,trafficking, or carrying of weapons, while also preventing alteration orremoval of serial numbers located on weapons such as firearms. Themethods described above may be used to provide structural encoding onvirtually any weapon or weapon part by (1) directly fabricatingcomponents with structural encoding either externally accessible orfully embedded within the component and not accessible without one ormore of the imaging processes described herein, or (2) fabricating afraction or portion of a major component or subsystem with structuralencoding information on or in it, and then incorporating the portion onor in the major component either as an attachment or embedded within alarger component through assembly or integration during fabrication ofthe larger component.

The readable portion 334 is structurally encoded with data that may berelated to the weapon manufacturer, the serial number, the weapon type,model, engineering design drawings and analyses, or production number,ammunition, the manufacture, assembly, or sale date, and any recall,service, repair, or ownership information, including country of origin.The readable portion 334 may be structured or manufactured according toany of the embodiments discussed above or shown in FIGS. 1-9. Suchencoded information may be read via any of the imaging methods discussedabove, including x-ray, fluoroscopy, computed tomography,electromagnetic radiation, ultrasound, positron emission tomography, andmagnetic resonance imaging, and may include error correction asdiscussed above.

Referring now to FIG. 13, a piece of jewelry 340 having a structurallyencoded component 342 is shown. The jewelry 340 shown in FIG. 13 is aring having a precious metal base with one or more gemstones embeddedwithin. However, any type of jewelry, such as bracelets, necklaces,watches, or earrings, is contemplated by the present disclosure.Additionally, the structurally encoded component 342 is, or forms partof, an in-ear hearing aid or other personalized medical instrument. Thestructurally encoded component 342 is or includes a readable portion344. The readable portion 344, as shown in FIG. 13, is locatedintegrally at an inner portion of the ring, but may be separatelyattachable as a decorative and/or valuable component to the jewelry. Thereadable portion 344 allows an enhanced measure of security for thejewelry as the methods for encoding discussed above allow a large amountof data to be included in a very small space, such as a surface or innerspace of a piece of jewelry.

The readable portion 344 of the jewelry shown in FIG. 13 is structurallyencoded with data that may be related to the jewelry designer, thedesign information including dates, the material type and quality, theserial number, any gemstone information such as research or laboratorycertification or grading, history, any sale, repair, or evaluation date,insurance information, and any ownership information. Because manyvaluable gemstones, such as diamonds, include a serial number engravedonto their surface, the structurally encoded component 342 of thepresent disclosure provides secure confirmation of such data for a pieceof jewelry that includes the valuable gemstone.

The readable portion 344 may be structured or manufactured according toany of the embodiments discussed above or shown in FIGS. 1-9. Suchencoded information may be read via any of the imaging methods discussedabove, including x-ray, fluoroscopy, computed tomography,electromagnetic radiation, ultrasound, positron emission tomography, andmagnetic resonance imaging, and may include error correction asdiscussed above.

As further contemplated by the present disclosure, other sensitiveobjects, such as pharmaceutical goods, having structurally encodedcomponents, packaging, or containers would benefit from the efficientand secure identification, tracking, and storage of information relatingto the objects. Additionally, the structurally encoded componentsdiscussed herein may be incorporated into or form part of consumerelectronics such as cell phones, or toys to track information relatingto such products.

FIG. 14 illustrates a method 1400 of inserting a data structure into acomponent using a 3D printer in accordance with one or more embodimentsof the present disclosure, as described above and/or illustrated in anyone or more FIGS. 1-13. The method 1400 includes providing, at step1410, data structure having at least one structural parameter associatedwith the component, converting, at step 1420, the data structure intoindicia representative of the data structure, and manufacturing, at step1430, the component containing the indicia.

The embodiments of the present disclosure, as shown individually inFIGS. 1-14, may be manufactured by one or more of the AM processesdescribed above. The method of manufacturing an identifiablestructurally encoded component according to a preferred embodiment ofthe present disclosure comprises providing an outer structure portion ofan identifiable structurally encoded component, providing a readableportion of an identifiable structurally encoded component, printing afirst material onto a first readable portion surface to create a firstprinted layer, and printing the first material onto the first printedlayer to create a second printed layer. At least one of the printing ofthe first material onto the first readable portion surface and theprinting of the first material onto the first printed layer comprisesprinting encoded indicia. Further, the encoded indicia may comprisevolumes of a second material having a different density than the firstmaterial found elsewhere in the readable portion of the identifiablestructurally encoded component. As an example, the readable portion ofan identifiable structurally encoded component may be formed by anadditive manufacturing (AM) or 3D printing process such thatmicro-volumes of a metal material having a relatively high density aredeposited within a polymer substrate having a relatively low density.The encoded indicia may also comprise voids in the first material of theidentifiable structurally encoded component. Further, any singleembodiment of the present disclosure may be manufactured using acombination of traditional manufacturing processes and additivemanufacturing processes. For example, a 3D printed structurally encodedcomponent with internal indicia formed by the 3D printing process mayalso have a series of notches micromachined onto an exterior surface ofthe 3D printed structurally encoded component.

The identifiable structurally encoded component of the presentdisclosure enables more accurate reporting, reviewing, and analyzing ofadverse event reports so that problem devices can be identified andcorrected more quickly. Additionally, the identifiable structurallyencoded component of the present disclosure reduces error bymanufacturing professionals, service professionals, and others torapidly and precisely identify a device and obtain important informationconcerning the characteristics of the device. The present disclosureenhances analysis of devices on the market by providing a standard andclear way to document device use in electronic records, testinginformation systems, claim data sources, and registries. Through thestructurally encoded component of the present disclosure, a more robustpost-market surveillance system may also be leveraged to supportpremarket approval or clearance of new devices and new uses of currentlymarketed devices. The present disclosure further provides a standardizedidentifier that will allow manufacturers, distributors, and servicefacilities to more effectively manage device recalls. Moreover, thepresent disclosure provides a foundation for a global, securedistribution chain, helping to address theft, counterfeiting, anddiversion and prepare for emergencies. The identifiable structurallyencoded component of the present disclosure enables development of adevice identification system that is recognized around the world.

While particular embodiments of the present disclosure have beenillustrated and described, it would be obvious to those skilled in theart that various other changes and modifications can be made withoutdeparting from the spirit and scope of the disclosure. It is thereforeintended to cover in the appended claims all such changes andmodifications that are within the scope of this disclosure.

I claim:
 1. A method of inserting a data structure into a componentusing a 3D printer, comprising: providing the data structure having atleast one structural parameter associated with the component; convertingthe data structure into indicia representative of the data structure;and manufacturing the component containing the indicia.
 2. The method ofclaim 1, further comprising controlling the 3D printer with instructionsrelating to the at least one structural parameter.
 3. The method ofclaim 2, wherein controlling the 3D printer further includes controllingat least one of a movement and a positioning of a material extruding jetnozzle within the 3D printer.
 4. The method of claim 1, wherein the atleast one structural parameter comprises at least one of a height of thecomponent, a width of the component, a depth, a color, a material, aweight, a density, a time, and a particle size to be deposited by amaterial extruding jet nozzle within the 3D printer.
 5. The method ofclaim 1, further comprising interconnecting linking structures to formthe indicia such that the linking structures convey meaning through atleast one of a size, a shape, an orientation, a density, a thickness, amass, a volume, a Miller Index, and a three-dimensional arrangement ofthe linking structures.
 6. The method of claim 1, wherein manufacturingthe component includes additive manufacturing the component using atleast one of a polymer, ceramic, elastomer, and metal.
 7. The method ofclaim 1, wherein the indicia comprise at least one of a number, analphanumeric figure, a decimal, a binary coded decimal, a hexadecimal, ahamming code, an illustration, text, a symbol, a shape, a color, asymbolic representation, and an arrangement of multiple items.
 8. Themethod of claim 1, wherein converting the data structure into theindicia comprises at least one of interpreting, encoding, translating,transforming, representing, compiling, and relating the data structureinto the indicia.
 9. The method of claim 1, wherein the indicia areassociated with the component using at least one of engraving theindicia into an interior or an exterior surface of the component,depositing the indicia as a raised marking on an interior or an exteriorsurface of the component, printing on a tag temporarily or permanentlyattached to the component, and a symbolic arrangement of items at leastone of inside of the component and outside of the component.
 10. Themethod of claim 1, wherein the component comprises a readable bodydefining a plurality of linking structures, each of the linkingstructures having at least one of a predetermined size and orientation,the linking structures being interconnected to substantially form thereadable body and the indicia.
 11. The method of claim 1 furthercomprising reading the indicia by means of at least one of x-ray,fluoroscopy, computed tomography, electromagnetic radiation, ultrasound,positron emission tomography, and magnetic resonance imaging, whereinthe indicia comprise at least two sets of data that can be read from atleast two different respective directions with respect to the readablebody, and wherein the indicia is subsurface of the component.
 12. Themethod of claim 1, wherein the at least one structural parameter furthercomprises step-by-step instruction for manufacturing the componentcontaining the indicia and for controlling a movement of a materialextruding jet to selectively deposit a material in a plurality ofsuccessive layers to construct the component derived from and conformingto the at least one structural parameter.
 13. A method of embeddingencoded data into a structurally encoded component, the methodcomprising: providing data comprising structural parameters of at leastone of size, shape, color, dimension, height, width, depth, material,blueprint, design, time, size of particles to be deposited, andstep-by-step instructions for producing the structurally encodedcomponent; populating a data structure with the structural parameters;converting the data structure into indicia representative of the datastructure; and controlling an operation of a 3D printer materialextruding jet to selectively deposit material in a plurality ofsuccessive layers to build the structurally encoded component whileinserting indicia derived from and conforming to the structuralparameters into the structurally encoded component.
 14. A systemcomprising: a plurality of structural parameters; a data structurepopulated with at least one of the structural parameters; indiciarepresenting the data structure; a 3D printer configured to produce aplurality of layers of material; and a component produced by theplurality of layers in conformity with the structural parameters andcontaining the indicia representative of the data structure.
 15. Thesystem of claim 14, wherein the structural parameters comprise at leastone of instructions, dimensions, specifications, height, width, depth,color, material, weight, density, blueprint, design, and size ofmaterial particles.
 16. The system of claim 15, wherein the structuralparameters comprise step-by-step instructions to control operation ofthe 3D printer to selectively produce the plurality of layers ofmaterial and construct a structurally encoded component containing theindicia and conforming to the structural parameters.
 17. The system ofclaim 14, wherein the indicia are associated with the component using atleast one of recessing the indicia into at least one of an interior andan exterior surface of the component, depositing indicia as a raisedmarking on at least one of an interior and an exterior surface of thecomponent, incorporating the indicia into a tag temporarily orpermanently attached to the component, and arranging items at least oneof inside and outside the component to form the indicia.
 18. The systemof claim 14, wherein the 3D printer includes at least one of a binderjet device, a material jet device, a direct energy deposition device, apower bed fusion device, a material extrusion processing device, a vatphotopolymerization device, and a sheet lamination device.
 19. Thesystem of claim 18, wherein the 3D printer includes the power bed fusiondevice, the powder bed fusion device including at least one of a lasersintering device, a selective laser sintering device, and a metal lasersintering device.
 20. The system of claim 18, wherein the 3D printerincludes the material extrusion processing device, the materialextrusion processing device further comprising a fused depositionmodeling device.